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Black Diamond LEO-3V700D Series Fanless System 3 Realtek LAN  ![Black Diamond LEO-3V700D Series <font color=brown>Fanless</font> System 3 Realtek LAN]()
 Black Diamond- LEO-3V700D System
Excellent heat-dissipating feature,
Dust-proof imperforate design
Chassis Fanless cooling system:
Dimension: 57 H x 246 W x 124 D mm
Material: Aluminum
Color: Black
VESA Mounting: 75 x 75 mm (option)
Weight: 1.22 Kg/ 2.68 lbs ( Incl. M/B )
Storage Space: CF card / 2.5" HDD (option)
Motherboard Features:
VIA V4 C7 1.5Ghz , 3 Realtek LAN , 1 x RS232
Motherboard Specifications:
CPU type:
. VIA C7 1.5GHz nano BGA2 400 pin, L1/L2 128K on die
Front Side Bus:
400/533 MHz
MB Chipset :
VIA CN700 + VIA VT8237R Plus
Graphics :
. Integrated with VIA CN700
. Shared system memory up to 64MB
Memory :
1 x DDR II SO-DIMM (max. 1GB)
IDE : Support Compact Flash card Type II for ATA interface
SATA : Support 1 x SATA port/ 2 x SATA ports (option)
Audio :(option)
. AC-Link for Audio CODEC, AC’97 2.1
. Supports Line-out/ Mic-in/ Line-in
LAN :
3 x Realtek RLT8100C 10/100 Mbps (optional Giga LAN)
IO function :
1 x RS232
USB :
4 x USB 2.0 (2 external + 2 internal)
Expand interface
PCIe mini card socket for USB interface
Power :
On board power DC +12V±5% convert into system
+3.3V/+5V/+12V
Dimension :
145 x 102 mm (3.5 inch)
Operation Temperature :
0 ~ 60°C
Operation Humidity :
5~95% @ 60°C, non-condensing
If you have any questions, please feel free to call (909)740-9788
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