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Home > Product Catalog > Embedded Fanless > Black Diamond LEO-3V700D Series Fanless System 3 Realtek LAN

Black Diamond LEO-3V700D Series Fanless System 3 Realtek LANClick to enlargeBlack Diamond LEO-3V700D Series <font color=brown>Fanless</font> System 3 Realtek LAN

Black Diamond- LEO-3V700D System

Excellent heat-dissipating feature,

Dust-proof imperforate design

Chassis Fanless cooling system:

Dimension: 57 H x 246 W x 124 D mm

Material: Aluminum

Color: Black

VESA Mounting: 75 x 75 mm (option)

Weight: 1.22 Kg/ 2.68 lbs ( Incl. M/B )

Storage Space: CF card / 2.5" HDD (option)

Motherboard Features:

VIA V4 C7 1.5Ghz , 3 Realtek LAN , 1 x RS232

Motherboard Specifications:

CPU type: . VIA C7 1.5GHz nano BGA2 400 pin, L1/L2 128K on die

Front Side Bus: 400/533 MHz

MB Chipset : VIA CN700 + VIA VT8237R Plus

Graphics :

. Integrated with VIA CN700

. Shared system memory up to 64MB

Memory : 1 x DDR II SO-DIMM (max. 1GB)

IDE : Support Compact Flash card Type II for ATA interface

SATA : Support 1 x SATA port/ 2 x SATA ports (option)

Audio :(option) . AC-Link for Audio CODEC, AC97 2.1

. Supports Line-out/ Mic-in/ Line-in

LAN : 3 x Realtek RLT8100C 10/100 Mbps (optional Giga LAN)

IO function : 1 x RS232

USB : 4 x USB 2.0 (2 external + 2 internal)

Expand interface PCIe mini card socket for USB interface

Power : On board power DC +12V5% convert into system +3.3V/+5V/+12V

Dimension : 145 x 102 mm (3.5 inch)

Operation Temperature : 0 ~ 60C

Operation Humidity : 5~95% @ 60C, non-condensing

If you have any questions, please feel free to call (909)740-9788




BL-3V700DList Price: $499.00On Sale: $349.00
Memory upgrade Option: 
CF Card upgrade Option: 
2.5 SATA Hard Drive with Installation Kit upgrade Option: 
Wireless LAN Option: 
VESA Mounting Option: 

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Copyright 2017 KOMUSA TECHNOLOGY, INC. All rights reserved. Information in this document is subject to change without notice. Pictures are for display only. They may be different from the actual products. All products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders. All sales are subject to KOMUSA TECHNOLOGY, INC. Terms and Policies.

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