| Home > Networking PC > 3x LAN Ports Embedded Networking Systems > BLACK DIAMOND Embedded x86 Platforms with NEO Chassis ( 3x LAN ) > Black Diamond CV700A-3R10C Embedded x86 Platforms CPU-1.0GHz with NEO Chassis - 3x LAN
Black Diamond CV700A-3R10C Embedded x86 Platforms CPU-1.0GHz with NEO Chassis - 3x LAN
CV860B1R40 CV860B1R4T CV860A1R53 CV860B1R8T CV860A1R80
CV860A1R10 CV860A - 1R10N CV860A1R10N
Chassis Fanless cooling system:
Dimension: 50mm x 275mm x 172mm ( H x W x D )
Material: Aluminum (Heavy Duty)
Color: Black
Motherboard Features:
VIA Eden C7 , 3LAN , SATA , Mini PCI
Motherboard Specifications:
CPU type:
. VIA Eden(V4)/ C7 nano BGA2 400 pin, L1/L2 128K on die
Front Side Bus:
400/533 MHz
MB Chipset :
VIA CN700 + VIA VT8237R Plus
Graphics :
. Integrated with VIA CN700
. Shared system memory up to 64MB
. MPEG-2 hardware VLD
. Resolution up to 1600 x 1200
TV-Out (Option) :
NTSC(M, J) or PAL(B,D,G,H,I,M,N,Nc)
Memory :
1 x DDR II SDRAM 533/400 (max. 1GB)
IDE :
. Ultra DMA-133/100/66 transfer protocols
. 1 x 40 pin 2.54mm, 1 x 44 pin 2.0mm
. Support Compact Flash card type II for ATA interface
Audio :
AC-Link for Audio CODEC, AC’97 2.1
LAN :
3 x Realtek 10/100 Mbps (optional Realtek/Intel Gigabit)
IO function :
2 x RS232
. Supports Hardware Monitor Controller
. Supports Infrared SIR and FIR
. Supports one printer port
USB :
6 x USB 2.0
SATA
One channel connector
SATA drive transfer rate is capable of up to 150MB/s
Expand interface
1 x Mini PCI for only PCI rev: 2.2 interface
Power :
On board power DC +12V±5% convert into system
+3.3V/+12V/+5V
Dimension :
200 x 150 mm
Operation Temperature :
0 ~ 60°C
Operation Humidity :
5~95% @ 60°C, non-condensing
Ordering Information
. CV700A-3R10C : 3 LAN, 1GHz, VIA C7 processor
If you have any questions, please feel free to call (562)282-0137
|
Safe and Secure Shopping! |
Copyright 2023 KOMUSA TECHNOLOGY, INC. All rights reserved. Information in this document is subject to change without notice. Pictures are for display only. They may be different from the actual products. All products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders. All sales are subject to KOMUSA TECHNOLOGY, INC. Terms and Policies. |
|
| |